H531B
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Product Features
UMTS, LTE Band
PCB Soldering Re-flow
Wide Operation Temperature Range -40 ~ 85℃
Compact Package Design for PCB Applications -
Size Display
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Specification Parameters
Model
Frequency（GHz）
F1Frequency（GHz）
F2Center Frequency
(GHz)Bandwidth
（GHz）Isolation
（dB）MININS LOSS
（dB）MAXenVSWR
MAXPower
(W)IMD
(@2X43dBm)
(-dBc)MAXH531B[2550-2650]MHz 2.550 2.650 2.600 0.100 23 0.3 1.15 100 - H531B[2400-2500]MHz 2.400 2.500 2.450 0.100 23 0.3 1.15 100 - H531B[2300-2400]MHz 2.300 2.400 2.350 0.100 23 0.3 1.15 100 - H531B[2110-2170]MHz 2.110 2.170 2.140 0.060 23 0.3 1.15 100 - H531B[1930-1995]MHz 1.930 1.995 1.963 0.065 23 0.3 1.15 100 - H531B[1805-2025]MHz 1.805 2.025 1.915 0.220 18 0.35 1.28 75 - H531B[1880-1920]MHz 1.880 1.920 1.900 0.040 23 0.3 1.15 100 - H531B[930-960]MHz 0.930 0.960 0.9450 0.030 21 0.45 1.2 50 - H531B[865-880]MHz 0.865 0.880 0.8725 0.015 21 0.45 1.2 50 - H531B[851-866]MHz 0.851 0.866 0.8585 0.015 21 0.45 1.2 50 -
