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H103B

• Product Features

  UMTS, LTE Band
  PCB Soldering Re-flow
  Wide Operation Temperature Range -45 ~ 125℃
  Compact Package Design for PCB Applications

• Size Display

  

• Specification Parameters

  Model		Frequency（GHz） F1	Frequency（GHz） F2	Center Frequency (GHz)	Bandwidth （GHz）	Isolation （dB）MIN	INS LOSS （dB）MAXen	VSWR MAX	Power (W)	IMD (@2X43dBm) (-dBc)MAX
  HYH103BZ0.0 (2486-2720)MHz											2.486	2.720	2.603	0.234	25	0.22	1.12	100	-65
  HYH103BF0.0(2300-2400)MHz		2.300	2.400	2.350	0.100	23	0.25	1.15	100	-65
  HYH103BF0.0(2110-2170)MHz		2.110	2.170	2.140	0.060	23	0.25	1.15	100	-70
  HYH103BF0.0(1930-1990)MHz		1.930	1.990	1.960	0.060	23	0.25	1.15	100	-65
  HYH103BF0.0(1840-2055)MHz		1.840	2.055	1.948	0.215	25	0.25	1.12	100	-70
  HYH103BF0.0(1805-1880)MHz		1.805	1.880	1.843	0.075	23	0.25	1.15	100	-65
  HYH103BF(1407-1507)MHz		1.407	1.507	1.457	0.100	20	0.25	1.22	100	HYH103BF0.0(1805-1880)MHz